3 Tescan FIBSEMs with gas injection system (Ga-ions),
FIBSEM integrated ToFSIMS detector for FIBSIMS 3D (trace) element mapping,
FEBiMS (focused electron beam induced mass spectrometry).
FIBSEM integrated indentation and tensile strain platforms with EBSD,
TKD grain orientation mapping,
Focused electron-induced deposition,
TEM (STEM, Diffraction, EDX).
PVD metals of thin films,
TEM lamella preparation by FIB,